April 24, 2017

VadaTech announces Time and Frequency module with on-board GPS

u-blox certifies world's smallest LTE Cat M1 module for Verizon’s 4G LTE network

Fujitsu Develops Circuit Technology to Improve Energy Efficiency of Hardware Used for Deep Learning

IAR Systems ensures complete code control for applications based on Renesas RX MCUs

Xilinx Showcases Vision Guided Machine Learning with reVISION at the Embedded Vision Summit 2017

Pentek’s Talon Recorders’ SystemFlow Software Touts New Features and Enhancements

Smartphone and Tablet App from STMicroelectronics Brings New Features for Selecting and Designing with Operational Amplifiers

Linear Technology Demonstrates Breakthrough Wireless Battery Management System in BMW i3 at Hannover Messe

Mentor collaborates with Microsoft to accelerate Internet of Things solutions

April 21, 2017

BeagleBone Black Wireless computer board now available from RS Components

Kisters enhances 3DViewStation with advanced 3D CAD model analysis functions

Cadence Tensilica Vision P-Series DSPs are Industry’s First Imaging/Vision DSPs Certified by Khronos as OpenVX 1.1 Conformant

April 20, 2017

Avnet and Xilinx Expand Global Channel Relationship

Synopsys Enhances ARC Data Fusion Subsystem with New Audio and High-Performance Sensor Support for Always-On IoT Applications

Comcast Joins LoRa Alliance™ as Sponsor Member; Hosts Next All-Members Meeting and Showcases Citywide LoRaWAN™ Network Deployment

Mentor Graphics Expands Formal Verification’s Reach with New Cross-Platform GUI and Apps for Sequential Logic Equivalence Checking and CDC Gate-Level Analysis

New R&S TS-290 IoT carrier acceptance test system from Rohde & Schwarz facilitates IoT integration

April 19, 2017

CEL Launches New High Power CG2409 RF Switch Family for Wireless Applications

New Silexica SLX Automotive Design Tools Feature Infineon TriCore Models

Avnet Expands Interconnect and Power Portfolio with New Global Bel Fuse Franchise Agreement

TE Connectivity Launches Next Generation ARINC 600 Press Fit Contacts

Macronix MX25R Ultra Low Power QSPI Memory Selected by STMicroelectronics for New Low-Power STM32L4 MCU for Wearables, Smarter Things and Environment

April 18, 2017

L-com Debuts New USB 3.0 Type-C Cable Assemblies

Space Systems Finland selects VectorCAST for ECSS-E-40 Software Development - Software Criticality Category B and C

Rambus Expands Cryogenic Memory Collaboration with Microsoft

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