February 24, 2017

Waves Audio and CEVA Partner for Far-Field Voice Pick Up and Psychoacoustic Sound Enhancement Solutions targeting Mobile, Smart Home and Wireless Audio Markets

MaxLinear Showcases 5G & Backhaul Leadership with New Family of Broadband Microwave Transceivers

u-blox launches ground-breaking super-low-power GNSS receiver chip for wearable applications

Pixus Offers Hard-To-Find Rails and Other Subrack Components

Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP

February 23, 2017

VadaTech launches a dual-channel IF signal conditioning unit

CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

Sequans and Orion Labs Partner to Develop First LTE-enabled Wearable with Monarch LTE-M Chip

STMicroelectronics Works with Sigfox to Extend Plug-and-Play IoT Security to Industrial and Consumer Device Makers

New Bidirectional Power-Switching Solution is One of the Industry’s Smallest

Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs

Renesas Electronics Europe: Third European MCU Car Rally Competition Showcases Student Creativity with State-of-the-Art Renesas Solutions at Embedded World 2017

February 22, 2017

Tiny fibers open new windows into the brain

Ultrahaptics collaborates with HARMAN to integrate mid-air haptic sensations into connected cars

Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions

First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP

CUI Successfully Deploys its Software Defined Power Solutions (ICE Block) to Industry-Leading Data Center Operators

LETI TO PRESENT LATEST R&D RESULTS ON Three Alternatives to EUV and 193nm Lithography at SPIE Meeting in US

Sequans Introduces Monarch SX: LTE-M/NB-IoT System-on-Chip for Integrated IoT Devices

STMicroelectronics Extends Flexibility of STM32 Ecosystem with Latest STM32F722 Nucleo board and STM32F723 Discovery kit

EXFO and Rohde & Schwarz accelerate troubleshooting of mobile networks

Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology

February 21, 2017

STMicroelectronics Delivers Superior-Performing NFC Technology for Secure Contactless Payments and IoT Applications

Accellera Day Opens DVCon U.S. on Monday, February 27 with Three Timely Tutorials

Connected cars: Rohde & Schwarz Cybersecurity now provides dedicated security solutions for IoT automotive telematics

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