EEJournal

Reshaping the Future of Data: How NTT and IOWN will Change How the World Communicates

by Amelia Dalton - April 24, 2026

Today, we’re diving deep into the future of connectivity, networking, and computing with a look at a revolutionary concept: the Innovative Optical and Wireless Network, or IOWN. My podcast guest is Marco Provolo, Head of IOWN and NTT R&D Global Promotion Office. Marco and I discuss what IOWN is, why the shift from silicon to photonics is so crucial, how NTT is working … Read More → "Reshaping the Future of Data: How NTT and IOWN will Change How the World Communicates"

Want to Build Chips 10X faster and at 50% Lower Cost (Without Changing Existing Tools or Workflows)?

by Max Maxfield - April 23, 2026

I have some news that will make chip and chiplet designers (we’re talking ASIC, ASSP, SoC, and multi-die systems) squeal in delight. However, before we leap headfirst into the fray with gusto and abandon (and, it goes without saying, but I’ll say it anyway, aplomb), I just got off a call with my old chum, Adam Taylor.

As you may recall from an Read More → "Want to Build Chips 10X faster and at 50% Lower Cost (Without Changing Existing Tools or Workflows)?"

Scaling Advanced Materials for the Future of Battery Manufacturing: An Interview with Joe Adiletta of Volexion

by Amelia Dalton - April 17, 2026

In this week’s podcast, we’re stepping onto the frontier of battery innovation! My guest is Volexion CEO Joe Adiletta. Joe and I discuss why some battery materials perform great in a lab but fail in real world production, what “designing backward from the factory” means in terms of battery design and the role that manufacturing plays … Read More → "Scaling Advanced Materials for the Future of Battery Manufacturing: An Interview with Joe Adiletta of Volexion"

Articles Archive →
industry news
April 24, 2026
IK Multimedia Introduces ARC X Immersive for Professional Multichannel Calibration
A new system to track material design processes
STMicroelectronics reveals high-precision op amps for 4V-36V range
Arm and Google Cloud redefine agentic AI infrastructure with Axion processors
Synopsys Partners with TSMC to Power Next-Generation AI Systems with Silicon Proven IP and Certified EDA Flows
April 23, 2026
Introspect Technology Adds New ATE-on-Bench Solution for LPDDR6, DDR6, and HBM Interfaces
ROHM Develops 5th Generation SiC MOSFETs with Approximately 30% Lower On-Resistance at High Temperatures
Posifa Technologies Introduces PGS5100 Series Hydrogen Sensors for EV Battery Safety and Leak Monitoring
Quantum chips: Infineon contributes industrialization know-how to European quantum pilot lines
Essent Reduces Contact Centre Technology Costs by 50%
April 22, 2026
GigaDevice GD32F5HC Series MCU Grand Launch, Advancing High‑Performance Innovation for HMI and IoT Edge Solutions
SEGGER Adds Support for OnMicro OM662X Series to J-Link and Flasher
Introspect Technology Adds New ATE-on-Bench Solution for LPDDR6, DDR6, and HBM Interfaces
Quinas Technology advances ULTRARAM development with atomic-scale processing at KAUST Core Labs
MobileDemand Launches High-Precision Mobile Dimensioning Solution Powered by Orbbec Stereo 3D Camera
Wind River Joins the CHERIAlliance and Collaborates with Innovate UK to Accelerate Cybersecurity Innovation
Siemens and OnLogic Partner to Bring Industrial Edge to the Harshest Environments
April 21, 2026
EMI Filter for high-field MRI systems and sensitive imaging processes from EMIS
KYOCERA AVX Launches new Traction-Grade DC Filtering Capacitors
RS and Festo make smart electric motion accessible
STMicroelectronics reveals high-precision op amps for 4V-36V range
April 20, 2026
SECO USA Achieves AS9100D Certification for Aerospace Quality Management
AutoFlight Completes First 2-Ton-Class eVTOL Tea Delivery in China
Doble Engineering and Megger Unite to Shape the Future of Electrical Asset Management
Altech 60A IEC 60309-II Pin and Sleeve Devices Combine Security and Safety
Reelables Launches Anywhere, First Printable Smart Label for Bluetooth and Cellular Networks That Can Track Cargo and Parcels Anywhere in the World
April 17, 2026
IDS: Digital precision transforms aircraft construction with Ensenso 3D vision
ZincFive Surpasses 2 GW Milestone Underscoring Commercial Adoption of Nickel-Zinc in Data Centers
Synopsys Solutions Support NASA’s Artemis Program with Spacesuit Analysis and Communication System Development
Next-generation MIL-HD2 connector series from Amphenol aligned with SOSA™/VITA 91 now available through Powell Electronics
Curtiss-Wright introduces PacStar 424 tactical 5G gateway for secure, high-speed connectivity at the edge
April 16, 2026
Vexlum and Menlo Systems launch collaboration to streamline optical clock development
Wireless Broadband Alliance Issues New Wi-Fi Security Guidelines to Advance Trust, Privacy and Seamless Global Roaming
Taoglas to Showcase Antenna Innovation and Host GNSS Masterclass at EuCAP 2026
New COM Express modules with Intel Core Series 3 processors for cost- and energy-optimized embedded computing applications
Corvus Robotics Launches Corvus Trident, an AI Powered Device That Tracks Every Pallet from Dock Door to Departure
Smart, easy to use, eco-friendly: FX-250 digital fiber sensor
DELO Expands Medical Electronics Portfolio With Five New IBOA-Free Adhesives
Microchip Expands dsPIC33A DSC Family for High-Density AI Data Center Power, Complex Motor Control and Intelligent Sensing
Mission accomplished: Infineon technology proves reliable once again in space on Artemis II
April 15, 2026
NTT Research Launches Scale Academy and New Quantum – Safe Security Platform
TDK announces third-generation 1500 W wide-range AC-DC power modules
Thoro Unveils New Autonomous Solution Powered by Orbbec, Driving Scalable Material Handling Innovation
Saelig Launches Harogic PXN Series 4.5/6/9GHz Handheld Spectrum Analyzers
Indium Corporation Presents Collaborative Research on Solder Alloy Reliability for Heterogeneous Integration at ICEP-HBS
News Archive →

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Click here for more information about Qorvo SATCOM 13.75GHz to 14.5GHz GaN Power Amplifiers
Mar 30, 2026
25,375 views

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

discussion
Want to Build Chips 10X faster and at 50% Lower Cost (Without Changing Existing Tools or Workflows)?
Posted on Apr 23 at 8:01am by Max Maxfield
If I were in charge of the universe (I still don't understand why this hasn't happened yet), I'd tell those who don the undergarments of authority and stride the corridors of power at Breker and Moores Lab AI that they should strongly consider merging together, but no one asked me (...
In Memoriam: Tracy Kidder, author of Pulitzer Prize-Winning “The Soul of a New Machine”
Posted on Apr 15 at 8:48am by Steven Leibson
Thanks for the PALs, John. They were truly a contribution to the electronics world.
In Memoriam: Tracy Kidder, author of Pulitzer Prize-Winning “The Soul of a New Machine”
Posted on Apr 14 at 1:46pm by John Birkner
Hi Steve, it was truly remarkable that Tracy Kidder, a non-technical writer, could produce a work so insightful it inspired even veteran engineers like yourself to embrace new paradigms like programmable logic and PALs. At MMI, we were absolutely delighted by the book's release. Thanks for the memories.
In Memoriam: Tracy Kidder, author of Pulitzer Prize-Winning “The Soul of a New Machine”
Posted on Apr 14 at 6:49am by Max Maxfield
Hi Steve -- thanks for this remembrance. I remember how engrossed I was when reading “The Soul of a New Machine” back in the mists of time when I wore a much younger man's clothes -- Tracy brought the entire design process alive in a way few people have before ...
Artemis II Moon Mission’s FPGA-Based Space Toilet Poops Out Shortly After Reaching Earth Orbit, Repaired by Space Plumber
Posted on Apr 7 at 8:04am by Max Maxfield
Plumbing is one of those things you don't really think about... until it stops working. There's one thing about being a plumber... you'll never be short of "friends" who call you in the early hours of the morning :-)
Moore’s Law and the Seven Devices
Posted on Apr 6 at 4:05pm by Steven Pietrobon
Thanks! I'm glad you found the information useful. A small update. I found a schematic for the 958 RTL decade counter [11]. This shows only 12 components per register (two clock input resistors were deleted), 7 components for the clock buffer and 3 components for the AND gate, giving a total of 58 components, agreeing with ...
Moore’s Law and the Seven Devices
Posted on Apr 6 at 5:59am by Steven Leibson
Steven, thank you for this additional information!
Moore’s Law and the Seven Devices
Posted on Apr 6 at 5:53am by Steven Pietrobon
>Device #2: Fairchild µLogic Type G RTL IC, 7 components, circa 1962. This is a 3-input NOR gate, available in a TO-99 8-pin can, although you could buy a version where two of the pins were cut off (package code 5C). The die shown is the original non-epitaxial process where the base ...
Bumblebees Can’t Fly, and Humans Can’t Exist (I Have Proof)
Posted on Mar 16 at 9:54am by Max Maxfield
Thank you for this very detailed and thought-provoking comment. I must admit that I'm constantly amazed by how intricate and wonderful things are, and I'm not oblivious to Romans 1:20: "For since the creation of the world God's invisible qualities—his eternal power and divine nature—have been clearly seen, being ...
Bumblebees Can’t Fly, and Humans Can’t Exist (I Have Proof)
Posted on Mar 14 at 6:02am by clixandru1
Great article. Thank you for writing it. I would add a few things. If you extend your right arm forward horizontally with palm facing up like holding a plate, you will notice your right thumb points laterally. If you rotate the palm normally towards your left side to the maximum, ...
Subscribe Now

featured blogs
Human Artifacts Discovered on Mars!
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....
More from Max's Cool Beans...

chalk talks
GaN for Humanoid Robots
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Eric Persson and Amelia Dalton explore why power is the key driver for efficient and reliable robot movements and how GaN technologies can help motor control solutions be more compact, integrated and efficient. They also investigate the role of field-oriented control in humanoid robotic applications and why the choice of a GaN power transistor can make all the difference in your next humanoid robot project!
Click here for more information about Infineon Technologies Motor Control Solutions for Humanoid Robots
Apr 20, 2026
4,007 views
Nexperia GaN Power Proliferating in All Things Motor Control/Drive
Sponsored by Mouser Electronics and Nexperia
In this episode of Chalk Talk, Art Gonsky from Nexperia and Amelia Dalton discuss the biggest challenges of electric motors and controllers and how GaN power solutions can help solve these issues. They  also investigate how silicon, silicon carbide and GaN power solutions compare and how Nexperia and NXP technologies can get your next motor control design up and running in no time!     
Click here for more information about Nexperia GAN039 CCPAK1212-Packaged Power GaN FETs
Mar 25, 2026
29,507 views
Chalk Talk Archive →